INTERACTIVE DEMOS
A 300mm wafer fab processes 5,000 wafers/week through 400+ process steps. Yield excursions in photolithography or etch can destroy an entire lot worth $2M. The process engineering team needs to catch drift within minutes, not after the end-of-lot inspection.
| wafer_id | lot_id | tool_id | step | thickness_nm | uniformity_pct | defect_count | ts |
|---|---|---|---|---|---|---|---|
| W-44801 | LOT-2290 | LT-07 | PHOTORESIST_COAT | 1252.1 | 98.2 | 0 | 2024-03-15T06:00:12.000Z |
| W-44802 | LOT-2290 | LT-07 | PHOTORESIST_COAT | 1254.3 | 97.9 | 0 | 2024-03-15T06:03:45.000Z |
| W-44803 | LOT-2290 | LT-07 | PHOTORESIST_COAT | 1256.8 | 97.4 | 1 | 2024-03-15T06:07:18.000Z |
| W-44804 | LOT-2290 | LT-07 | PHOTORESIST_COAT | 1259.1 | 96.8 | 1 | 2024-03-15T06:10:51.000Z |
| W-44805 | LOT-2290 | LT-07 | PHOTORESIST_COAT | 1261.7 | 96.1 | 2 | 2024-03-15T06:14:24.000Z |
| W-44806 | LOT-2290 | LT-07 | PHOTORESIST_COAT | 1264.2 | 95.5 | 3 | 2024-03-15T06:17:57.000Z |
CREATE SOURCE process_metrology WITH (
connector = 'kafka',
topic = 'fab.metrology.inline',
properties.bootstrap.server = 'broker:9092'
) FORMAT PLAIN ENCODE JSON;| tool_id | parameter | deviation_sigma | consecutive_oor | lot_impact | alert_level |
|---|---|---|---|---|---|
| LT-07 | thickness_nm | 2.3 | 8 | FULL_LOT | WARNING |
| LT-07 | thickness_nm | 2.8 | 12 | FULL_LOT | WARNING |
| LT-03 | thickness_nm | -0.3 | 0 | PARTIAL_LOT | WATCH |